Site-selective growth of patterned silver grid networks as flexible transparent conductive film by using poly(dopamine) at room temperature.
Identifieur interne : 000049 ( Main/Exploration ); précédent : 000048; suivant : 000050Site-selective growth of patterned silver grid networks as flexible transparent conductive film by using poly(dopamine) at room temperature.
Auteurs : RBID : pubmed:24380441Abstract
Metal transparent conductive films (TCFs) have received increasing attention in various flexible electronics. However, there are two crucial issues that need to be addressed: (1) strong adhesion between metal TCFs and the flexible substrates and (2) high conductivity with short treatment time and low process temperature, simultaneous with high transparency. In this paper, a site-selective electroless plating combination with poly(dopamine) modification is demonstrated to fabricate a new high performance transparent conductor composed of a periodic two-dimensional silver network on a heat sensitive flexible substrate at room temperature. The TCF reveals an extremely high ratio of DC to optical conductivity (σ(DC)/σ(Op)) value in the range of 350-1000 for various fabricated silver grid films. It also exhibits particularly strong adhesion, which can resist ultrasonic treatment in water or organic solvent for several hours. Its reliability (stable for at least 1440 h during 85 °C/85% RH aging) meets the essential requirements for microelectronic applications. Using this method, we obtain silver grid film on a flexible polyethylene terephthalate substrate with optical transmittance of 91% and sheet resistance of 8 Ohm sq(-1), which is comparable to or better than the commercially available indium tin oxide.
DOI: 10.1021/am402900u
PubMed: 24380441
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<record><TEI><teiHeader><fileDesc><titleStmt><title xml:lang="en">Site-selective growth of patterned silver grid networks as flexible transparent conductive film by using poly(dopamine) at room temperature.</title><author><name sortKey="Jin, Yunxia" uniqKey="Jin Y">Yunxia Jin</name><affiliation wicri:level="1"><nlm:affiliation>Department of Materials Science, Fudan University , 220 Handan Road, Shanghai 200433, China.</nlm:affiliation><country xml:lang="fr">République populaire de Chine</country><wicri:regionArea>Department of Materials Science, Fudan University , 220 Handan Road, Shanghai 200433</wicri:regionArea></affiliation></author><author><name sortKey="Cheng, Yuanrong" uniqKey="Cheng Y">Yuanrong Cheng</name></author><author><name sortKey="Deng, Dunying" uniqKey="Deng D">Dunying Deng</name></author><author><name sortKey="Jiang, Chengjie" uniqKey="Jiang C">Chengjie Jiang</name></author><author><name sortKey="Qi, Tianke" uniqKey="Qi T">Tianke Qi</name></author><author><name sortKey="Yang, Donglun" uniqKey="Yang D">Donglun Yang</name></author><author><name sortKey="Xiao, Fei" uniqKey="Xiao F">Fei Xiao</name></author></titleStmt><publicationStmt><date when="2014">2014</date><idno type="doi">10.1021/am402900u</idno><idno type="RBID">pubmed:24380441</idno><idno type="pmid">24380441</idno><idno type="wicri:Area/Main/Corpus">000228</idno><idno type="wicri:Area/Main/Curation">000228</idno><idno type="wicri:Area/Main/Exploration">000049</idno></publicationStmt></fileDesc><profileDesc><textClass></textClass></profileDesc></teiHeader><front><div type="abstract" xml:lang="en">Metal transparent conductive films (TCFs) have received increasing attention in various flexible electronics. However, there are two crucial issues that need to be addressed: (1) strong adhesion between metal TCFs and the flexible substrates and (2) high conductivity with short treatment time and low process temperature, simultaneous with high transparency. In this paper, a site-selective electroless plating combination with poly(dopamine) modification is demonstrated to fabricate a new high performance transparent conductor composed of a periodic two-dimensional silver network on a heat sensitive flexible substrate at room temperature. The TCF reveals an extremely high ratio of DC to optical conductivity (σ(DC)/σ(Op)) value in the range of 350-1000 for various fabricated silver grid films. It also exhibits particularly strong adhesion, which can resist ultrasonic treatment in water or organic solvent for several hours. Its reliability (stable for at least 1440 h during 85 °C/85% RH aging) meets the essential requirements for microelectronic applications. Using this method, we obtain silver grid film on a flexible polyethylene terephthalate substrate with optical transmittance of 91% and sheet resistance of 8 Ohm sq(-1), which is comparable to or better than the commercially available indium tin oxide.</div></front></TEI><pubmed><MedlineCitation Owner="NLM" Status="In-Process"><PMID Version="1">24380441</PMID><DateCreated><Year>2014</Year><Month>02</Month><Day>12</Day></DateCreated><Article PubModel="Print-Electronic"><Journal><ISSN IssnType="Electronic">1944-8252</ISSN><JournalIssue CitedMedium="Internet"><Volume>6</Volume><Issue>3</Issue><PubDate><Year>2014</Year><Month>Feb</Month><Day>12</Day></PubDate></JournalIssue><Title>ACS applied materials & interfaces</Title><ISOAbbreviation>ACS Appl Mater Interfaces</ISOAbbreviation></Journal><ArticleTitle>Site-selective growth of patterned silver grid networks as flexible transparent conductive film by using poly(dopamine) at room temperature.</ArticleTitle><Pagination><MedlinePgn>1447-53</MedlinePgn></Pagination><ELocationID EIdType="doi" ValidYN="Y">10.1021/am402900u</ELocationID><Abstract><AbstractText>Metal transparent conductive films (TCFs) have received increasing attention in various flexible electronics. However, there are two crucial issues that need to be addressed: (1) strong adhesion between metal TCFs and the flexible substrates and (2) high conductivity with short treatment time and low process temperature, simultaneous with high transparency. In this paper, a site-selective electroless plating combination with poly(dopamine) modification is demonstrated to fabricate a new high performance transparent conductor composed of a periodic two-dimensional silver network on a heat sensitive flexible substrate at room temperature. The TCF reveals an extremely high ratio of DC to optical conductivity (σ(DC)/σ(Op)) value in the range of 350-1000 for various fabricated silver grid films. It also exhibits particularly strong adhesion, which can resist ultrasonic treatment in water or organic solvent for several hours. Its reliability (stable for at least 1440 h during 85 °C/85% RH aging) meets the essential requirements for microelectronic applications. Using this method, we obtain silver grid film on a flexible polyethylene terephthalate substrate with optical transmittance of 91% and sheet resistance of 8 Ohm sq(-1), which is comparable to or better than the commercially available indium tin oxide.</AbstractText></Abstract><AuthorList CompleteYN="Y"><Author ValidYN="Y"><LastName>Jin</LastName><ForeName>Yunxia</ForeName><Initials>Y</Initials><Affiliation>Department of Materials Science, Fudan University , 220 Handan Road, Shanghai 200433, China.</Affiliation></Author><Author ValidYN="Y"><LastName>Cheng</LastName><ForeName>Yuanrong</ForeName><Initials>Y</Initials></Author><Author ValidYN="Y"><LastName>Deng</LastName><ForeName>Dunying</ForeName><Initials>D</Initials></Author><Author ValidYN="Y"><LastName>Jiang</LastName><ForeName>Chengjie</ForeName><Initials>C</Initials></Author><Author ValidYN="Y"><LastName>Qi</LastName><ForeName>Tianke</ForeName><Initials>T</Initials></Author><Author ValidYN="Y"><LastName>Yang</LastName><ForeName>Donglun</ForeName><Initials>D</Initials></Author><Author ValidYN="Y"><LastName>Xiao</LastName><ForeName>Fei</ForeName><Initials>F</Initials></Author></AuthorList><Language>eng</Language><PublicationTypeList><PublicationType>Journal Article</PublicationType><PublicationType>Research Support, Non-U.S. Gov't</PublicationType></PublicationTypeList><ArticleDate DateType="Electronic"><Year>2014</Year><Month>01</Month><Day>14</Day></ArticleDate></Article><MedlineJournalInfo><Country>United States</Country><MedlineTA>ACS Appl Mater Interfaces</MedlineTA><NlmUniqueID>101504991</NlmUniqueID><ISSNLinking>1944-8244</ISSNLinking></MedlineJournalInfo><CitationSubset>IM</CitationSubset></MedlineCitation><PubmedData><History><PubMedPubDate PubStatus="aheadofprint"><Year>2014</Year><Month>1</Month><Day>14</Day></PubMedPubDate><PubMedPubDate PubStatus="entrez"><Year>2014</Year><Month>1</Month><Day>2</Day><Hour>6</Hour><Minute>0</Minute></PubMedPubDate><PubMedPubDate PubStatus="pubmed"><Year>2014</Year><Month>1</Month><Day>2</Day><Hour>6</Hour><Minute>0</Minute></PubMedPubDate><PubMedPubDate PubStatus="medline"><Year>2014</Year><Month>1</Month><Day>2</Day><Hour>6</Hour><Minute>0</Minute></PubMedPubDate></History><PublicationStatus>ppublish</PublicationStatus><ArticleIdList><ArticleId IdType="doi">10.1021/am402900u</ArticleId><ArticleId IdType="pubmed">24380441</ArticleId></ArticleIdList></PubmedData></pubmed></record>Pour manipuler ce document sous Unix (Dilib)
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